3DVU is a 3D Viewer and DRC checker for both simple and advanced packages ...It can be used to visualize complicated packages in 3D and also to check wire clearances in full 3D. Additional modules for 3Di to ACIS conversion available.

ACADto3Di is a new 3D package modeler built into AutoCAD. It allows the user to "create" 2D drawings of package and to then "extrude" them into 3D where a full 3D visualization and DRC can be done ...

Wirebond reduces the time required to create bond wire documents from hours to minutes. Imports the die, places it, wires it, wire DRC, separate wires by tier, auto-documentation. Runs inside of AutoCAD 2004/2008. Tagger is used to add intelligence to "dumb" leadframe and BGA drawings. Together the two programs accelerate the generation of bond documents for the factory floor.

Automatically generate a bond wire documentation package in minutes from a new design done in Cadence APD or Xynetix Encore BGA (Now Sigrity.) Bondgen extracts the pads, wires, die and rings from a completed design (via the AIF format)and automates the layout, labeling and annotation of the bond document. Runs inside of AutoCAD 2004-2008.

SmartDie extracts pad coordinates and nets from a GDSII or AutoCAD dwg of the die. Builds a complete die netlist in seconds. Import the netlist into Wirebond, APD, Encore. Runs inside of AutoCAD 2004/2008.

Documentation Generator for BGA Substrates. Helps generate a multi-page documentation package inside of AutoCAD. Customized for each company's title border and documentation requirements. Runs in AutoCAD 2004-2008.

Our package design tool wizard and protoyper running inside of AutoCAD 2004/2008. Optimized for design of PBGA, SBGA, TAPE and HPBGA parts. Ideal for preliminary design of very dense staggered die and multi-ring packages; Interface to Encore BGA and Cadence APD.

Reads an ASCII list and import it into Excel for product engineers who need to document a BGA’s layout. The Ballmap program creates a cell for each ball pad. The signal name of the ball pad is listed in the center of the cell and the JEDEC labels are arranged outside the array.

AIF is a simple, open, text based data exchange format developed by Artwork together with Cadence and Xynetix, and users such as Amkor, Xilinx, AMD and Agere ... which is very useful for wirebond data exchange.