3DVU is 3D modeler, viewer and design rule checker intended for IC package designers. It reads a new database called 3Di which defines the package both in terms of geometries but also includes useful properties such as nets, material and package/pin information.

The 3D database is produced by extruding conductors and substrate information derived from two dimensional PCB layout tools. 3D wires are generated by using the 2D coordinates and applying a Z model to create an accurate representation of the wire's sweep. Nets, package and pin information are extracted from the PCB's layout database

Custom Wire Models

In addition to the two basic JEDEC wire models, 3DVU supports user defined custom wire models.

This allows both designers and assembly engineers to more accurately model the extreme wire profiles needed today for stacked die.

3D DRC

In addition to viewing, 3DVU includes a DRC module. This DRC does in three dimensions what conventional tools do in two dimensions. Wire to Wire spacing, Wire to Substrate and Wire to Metal spacing can be measured and flagged if out of spec.

3D Export

An optional plug-in, 3Di2sat, can convert the 3Di data into the ACIS database (also known by its file extension, sat.) This enables the user to transfer 3D data to a wide range of 3D mechanical tools such as SolidWorks and ProE and to a wide range of analysis tools from Ansys, Comsol and others.