Introduction
The 3Di format is a simple description of polygons in the X-Y plane that have a height and thickness attribute. Artwork developed this format as part of the effort to model IC packages and substrates in 3D. We also added property tables that allow one to tag each geometry with useful information: net names, materials, groups and such.
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The 3Di file is currently produced by some versions of Cadence's APD program but in fact any application can produce this file format and then view or check it using 3D-VU. We are documenting this format in case others who wish to develop 3D IC packaging tools would like to use this building block.
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