What is AIF? AIF is a simple ASCII file that describes either a die, or a BGA bondshell including the die. It is intended to be a universal method of describing the die for purposes of package design and wirebonding.

Both IC designers and package designers can use AIF as a simple, standard method of exchanging die data so that moving data between the two disciplines is simple and efficient.

We work closely with both package designers and IC designers to come up with the simplest representation of the die that meets the needs of both types of designers. We've tried to avoid creeping "featuritis" that would make the format more complicated and difficult to create or parse.

To help make adoption of AIF faster we have developed a family of tools that can read and write AIF and do useful things with the data.

Artwork developed AIF Version III in order to support flipchip, stacked die and MCMs; however no commercial products have been released that use AIF III. Interested parties should contact Artwork directly if an application is needed that takes advantage of AIF III's full support for hierarchy and layering.