Die Import - Die Netlist Import

Package designers generally get information about the die in a netlist format. This data needs to be entered into AutoCAD if you wish to create bond wire diagrams or if you wish to design a BGA package for the chip. Artwork has developed a simple yet easy-to-use program called Die Import that reads a die netlist and automatically draws the chip in AutoCAD.		Features Import Die Netlist into AutoCAD Ideal for Bond Diagrams AutoCenter the Die Rotate the Die Counts Signal, Power and Ground Runs Inside of AutoCAD 14
We added features requested by our clients: Automatic centering if the original netlist coordinates are not centered around 0,0. Rotation: you can insert the chip at 0,90,180, or 270 degrees. Counting PAD Types For BGAs it is important to know how many pads on each side of the die are signals, grounds or powers. We added a routine that will compare the netname for each pad to a predefined list of names identifying the pad as a power or ground. We then count each type of pad and generate a report.

At left you can see the results of importing a rectangular die with 288 pads. The entire process takes about 5 seconds to create the pads and another 20-30 seconds to sort them by top/bottom/left and right.

The sorting step is required for LTGEN which will create bond fingers.

User Interface

Main Menu - collects the required information to draw and place the die.

The user specifies the die netlist and a keyword file for power and ground nets.

If the die edge is not symmetric with respect to the pads then the user should also enter the corner coordinates; otherwise entering the die width and height is sufficient.

PAD Report
	Die Report - shows the number of I/O, Power, Ground and No Connect PADS on each side of the die. This information is useful to BGA designers who need to know how many bond fingers to use on each side of the package.

Additional Program Details
Program Flow	Netlist Format	Keyword File for Power, Ground and No Connect

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