Device ImageAt AMD, the bond drawing document includes a BW image of the die. This helps the operator determine that the correct die in the correct orientation is in place.
This image is obtained as follows:
The device's GDSII file is loaded and the user specifies which structure and layers to plot. He also specifies the size of the TIFF bitmap he wishes to create.
WireBond Main Page | Bondmaster Data Browser | Device Image | Device Cleaner
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