GDS-SR Revision History

1.33 [10/23/2017]

Fixed Bug in Script Input for Reticles

A bug that prevented the program from correctly importing and processing a script file that used a 2x2 reticle has been fixed.

1.32 [09/21/2017]

Reticle Input

The dialog box for defining reticle data has been improved to better handle reticles with a large number of die.

Reticle Bug

A bug was found in the assignment of SINF numbers when importing a reticle text file. This has been fixed.

1.26 [05/05/2017]

Fix Memory Overflow

Customer reported out-of-memory when stepping a very large GDSII unit die. This was found to be related to buffering the entire ASCII output during the conversion to GDSII. The buffering has been modified and the out-of-memory behavior fixed.

1.25 [09/20/2016]

Installer Includes Required Library

GDS-SR relies on a library (msflxgrd.ocx) that is not always present in newer versions of Microsoft Windows (8.1 and later). This required .ocx is now installed and registered during the installation. (When missing, certain dialogs won't open up)

1.24 [03/22/2016]

Change Die in Margin

User can now change die that lie in the margin area of the wafer. Previous versions did not allow this. The display will change the color of the die to correspond to that of the new device.

Auto Placement of Alignment Die added to Scripting

The scripting support now includes a new directive enabling placement of alignment die. This is in the numbered die section and valid values are LEFT and RIGHT. If such die are defined then they will be automatically placed without need to put them into the CHANGES section.


FNLOC User Control in Script

The SINF FNLOC parameter was previously set based on the side of the wafer that included a flat. However one client needs the standard value of 180 (which represents the flat or notch on the bottom) instead to read as 0. A section in the script now controls the settings:


FNLOC User Control in GUI

Added an FNLOC edit field to the Export SINF dialog. If set to a non-empty string, this value will override any value calculated from the wafer flat, including any of the new FNLOC properties defined above. This value persists between sessions, like the other SINF header edit fields.

Die Edge Parameter in Script

Added a DIE_EDGE_SPACING option to the SETTINGS section of the save file. This value is written to the save file and loaded from the save file, if present. This allows the die edge spacing value to be set from a script. The value persists for the current session but is not written to the registry. In this way, the default die edge spacing value is used until it is changed using the Settings dialog.


1.23 [03/06/2015]

Alignment Die in Reticle Mode

Changed the behavior of the function that places alignment die so that a) it is recorded in the Change Die database and b) die can be imported outside of reticle mode.

1.22 [02/25/2015]

Hide Reticle Display Interactively

In order to help the end user provide documentation that matches what a customer provided, reticles can be interactively hidden from the display. This allows a screen shot where the reticles generated by GDS-SR and those shown by the client will match. Does not update the database or GDSII output.

Change Die - Multiple Operations in Order

The change die function has been completely revised to support multiple operations (and undo) and to apply those operations in the order entered.

Look Up Table - SINF Bin Code to Color

A new look up table is used to associate a color with each SINF code. This is user editable.

Compensation for Die Extents (Poly)

As many die are designed with a poly layer that extends out beyond the true extents of the device, this extra value can now be entered into the defaults and will be accounted for when stepping the die and computing whether a die lies inside the wafer margin.

Import Dialog Enhancements

The import dialog has been enhanced to automatically assign SINF codes (and color based on the look up table) and to enable the user to easily identify product die, and left/right alignment die.

Alignment Die Placement Regions

Acceptable regions for placing alignment die can now be displayed for 200 and 300 mm wafers. An imported die which is identified as a left or right alignment die will be placed automatically in the optimum position.

Wafer Flat Keep Out

The keep out associated with the wafer flat does not have any margin value added to it.

Quick Change (Die)

This function has been returned to the GDS-SR program and it has been integrated with the Multiple Operations (Change Die) function.

1.21 [02/25/2014]

SINF Output Correction

The header field, BCEQU, will only contain die ID's that represent good die -- i.e. those with labels from 00-0A. Previous versions put all die ID labels in this field.

1.20 [04/10/2013]

Fixed Problem with Input File Hierarchy

Input files (GDSII) to be stepped that had a complex hierarchy were not correctly output (some hierarchy was lost). This has been fixed.

1.19 [03/28/2013]

Save Config updated

Updated the save document functionality to use the correct symbol (;) for the comment header. Previously it used # but this is not compatible with the script parser.

Script Bug Fix

Fixed a bug in the file parser which was corrupting the reticle cell size.

Script Update

Added support for relative file names when passing script file names to GDS-SR.

Script Engine Update

Added the -disable_messages command line option to disable any warning or information messages that might occur when running in script mode.

Die Reference in Reticle Mode

Reticle mode now forces the die center and stepping parameters. Not needed in the script file.

Step vs. Reticle Mode

STEPPING section no longer needed when running a reticle script.

Script Parser

DIES section only needs COUNT keyword when in reticle mode.

Script Parser

COUNT keyword not required in RETICLE section.

Script Engine

Reticle size or step size will be calculated if not present in RETICLE section.

1.18 [03/21/2013]

Reticle GUI Improvmenent

Made the grid containing die in the Reticle dialog re-sizable to make it easier to see long file names. For now, any changes are not remembered.

Resource File Updated

Updated the GDS-SR file format and Open and Save commands to properly store all document data.

Resource File support for Reticles and Die Changes

Modified the load/save files for the Changes and Reticle dialogs to use the updated GDS-SR file format. This means both dialogs can load partial/complete GDS-SR files, but only the applicable sections will be updated.

Custom SINF Label for Alignment Die

Added SINF label to the Edit Die dialog. These are automatically generated or loaded from a GDS-SR file and can be modified to support custom SINF codes in the exported SINF wafer map file.

Scripting Support

Added scripting support to GDS-SR. No special options are needed, though some are supported. In other words, just call gds-sr.exe <filename> and it will behave the same as if the file was opened manually and the options run. Extra options are:

  • If a GDSII file name is specified in the GDSII section, it will be generated with those parameters.
  • If the VIEW_GDSII value is YES and GDSII_VIEWER is defined in the GDSII section, the GDSII file will be opened for viewing. This will run asynchronously.
  • New DIE_PLACEMENT_TABLE section described in Twiki to ouput die placement table.
  • New SINF_WAFER_MAP section describe in Twiki to output SINF file.
  • New SCRIPT section for additional/future scripting options. Only option for now is AUTO_CLOSE=YES.
New Geometries in GDSII Output

Added support for exporting crosshairs, knock outs and reticle outlines to the GDSII file with individual layer definitions.

1.17 [03/07/2013]

Bug Fix - Reticle

Fixed a bug in the reticle dialog so that when a die is deleted it is also removed from the Dies dialog and no longer corrupts reticle structure names.

Bug Fix - Reticle

Fixed a bug displaying zeros in the reticle dialog's layout to indicate no die present.

Bug Fix - Window Position

Modified the remembered window placement of GDS-SR to avoid corruption in the registry values.

Reticle Outline Added

Added reticle outlines to the display. Their color and visiblity can be configured in the Color and Visibility Settings dialog.

Reticle Display Added

Added a display of the reticle count on the status bar, when in reticle mode.

1.16 [03/01/2013]

New Reticle Input Mode

Added a new Reticle Mode which supports the definition of a die reticle to be arrayed across the waver in a specified pattern. The reticle can contain multiple different die and can be offset. The reticle definition can be saved to a text file and reticle definitions can be loaded. A new indicator on the status bar shows when GDS-SR is running in Reticle Mode.

Bug Fix Change Die

Fixed a bug where the Change Die dialog was not using the correct structure name.

Bug Fix Array Computations

Fixed a bug where the array was leaving parts of the wafer empty if the offset was very large.

Bug Fix Margin Die Coloring

Fixed a bug where the margin die outline color was not being used correctly.

1.15 [02/21/2013]

Add Knockout Die by Direct Selection

Added support for knocking out die (changes the status to margin) by selection in the view window.

Add Knockout Die to the Change Die Dialog

Added support for knocking out die to the Change Die dialog.

Add Window Definition for Changing Die

Added support for window definition to the Change Die dialog. This applies to changing die, deleting die and knocking out die.

Info Dialog Updated

Added more data to the Info dialog.

1.14 [02/18/2013]

SINF output MM or MIL

Adjusted the SINF Wafer Map output to convert data to either mm (metric) or mil (imperial).

1.13 [02/15/2013]

Generate Sacrificial Die for Clipping

Added new functionality to generate sacrificial die covering the wafer margin.

SINF Output

Added SINF Wafer Map output.

Die Placement Table Output

Added Die Placement output.

Change Die Dialog (Rule Driven)

Added a new Change Die dialog which allows control of changing and deleting die using co-ordinates. The changes can be saved and loaded to text files.

1.12 [06/30/2011]

Bug Fix: Die Order

Fixed a bug where the combo box in the Change Die dialog was sorting the die names alphabetically. This was causing the order to change from that defined in the Edit Die dialog. This meant it was unpredictable which die would be inserted in place of the old die.

1.11 [07/06/2010]

Output GDSII Resolution Setting

A rounding error caused improper setting of the GDSII output file resolution. This has been fixed.

1.10 [06/09/2010]

Data Type Support Added

Previous versions of GDS_SR ignored the GDSII datatype parameter. This has been fixed - data is passed to the output with full datatype discrimination.

1.09 [06/08/2010]

Added PATH Support

Previous versions of GDS_SR dropped PATH data entities. This has been fixed.

1.08 [06/04/2010]

Wafer Flats

Added support for flats on all four sides of the wafer.

Output Directory for GDSII

Fixed a bug where exporting a GDSII file without a collar left the output file in the temp directory.

Coordinate Readout

Added a co-ordinate readout to the status bar as the mouse is moved.

Output Data Grid based on Input Data Grid

Previous versions hardwired the output GDSII grid to UM/1000. This revision detects the input data units/grid from the first die file imported and uses that as the output grid. Note that all targets and other imported files must have matching units and data grid.

Version 1.07 7/27/2007

Maximum number of die insertion increased.

Increased the maximum allowed number of die in each drection from 100 to 1000. That gives you a maximum number of 1,000,000 dies.

Version 1.06 11/18/05

Added units and precision data to the Import Die dialog.

This was done so that the user can be sure that all files imported have the same GDSII units and precision.

Added support for selecting a single structure from a collar target file.
Collar Cutout Data Entry

Fixed the collar command line in cases where the cutout parameters were not entered in the correct order. i.e. LLx, LLy, URx, URy

Wafer Disk Output

Added the ability to selectively export the wafer and margin along with the GDSII data. Users may want to see the wafer disk in the GDSII output during debugging but generally not for producing the final mask output.

Collar Generation Bug

Fixed a bug associated with synchronization of files created by the collar program.

Job File Info

The contents of the job file have been updated to support recording/reading of all of the new GDS-SR functions (including target placement, cutouts and collar parameters ...)

Version 1.05 [11/08/2005]

GUI Update

Re-organized the menus to better reflect the flow of the product.

Improved Preference Settings

Added a Settings dialog to the File menu which allows the user to define directories for input, output and temporary files.

Staggered Array

Added support for staggered array patterns.

Collar Generation

Improved the Collar Cutouts dialog, so that it used a spreadsheet style interface. Added support to define cutouts by center, width and height.

Target Placement

Added support for defining collar targets and mask labels.

Version 1.04 [09/28/2005]

Stepping Parameters

Added support for variable street size in x and y, as well as negative street size. This allows die to be over-lapped.

Collar Generator

Added collar generation function - a tool that finds the extents of the array and generates metal from the array edge out to the edge of the mask; includes user defined cutouts for placing targets and mask labels.

GDSII Output Control

Added Export Settings to control better which layers the wafer data is output on.

Version 1.03 [09/09/2005]

Array Multiple Die/Ratios

Modified GDS-SR to work better with multiple die in different ratios.

Version 1.02 [04/21/2005]

Import Mask File

Added the ability to import GDSII mask files. These files will be flattened and then the file <file_name>_flat.gds will have its boundaries imported into the viewer.

GDSII Export Added

Added the ability to export a GDSII file. The wafer data will be output as GDS ASCII and converted to GDSII. This GDSII file, <file_name>_wafer.gds, will be combined with all of the flattened mask files.

Multiple Die in Array

Added support for multiple die.The Import Die dialog now provides the option to over-ride a die definition or add a new die definition. In the case where the structures have the same name, the die must be over-ridden.

Delete Arrayed Die

Added the ability to delete selected die from the array. Re-generating the array rests any deleted die.

Replace Arrayed Die

Added the ability to change a die to another type. This allows modifying select die inside of the array to be targets or test devices.

Color and Pattern for Display

Added color and pattern options to the main display for the imported die array.

Display by Component

Added the ability to selectively view each component - wafer, margin, die array and collar.

SREF offset

Disabled the SREF offset setting when using street center as it does not apply.


Added an Info command which displays data about a die - the name, which file it came from, if any, and the insertion point.

Version 1.01 02/28/05

Initial Release

This is the initial release of GDS-SR.

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