While the original FA3ST was designed to quickly produce BGA shells for relatively simple package styles, FA4ST is intended to give the advanced designer much more flexibility in determining ring and finger geometries.

HPBGA package synthesized by FA4ST

• quickly create a dummy die based on input parameters.

• scan GDSII file to get the die pad coordinates.

• generate multiple rings with various geometries and chamfers/fillets.

• support for staggered die pads.

• generate multiple rows of staggered bond fingers.

• support for tape packages where the fingers lie between ball rows.

• user customizable netlist output.

• direct and intelligent interfaces to Encore and Cadence APD.

• New Flipchip Support!
  [PDF 10 pp. 250KB]