Importing Bond Wires

Bond Wires used to connect signals from the chip to its package are modeled as a path in space. The wire crossection can be a circle or a polygon.

Below you can see the trace with pads as viewed in Artwork's 3DVU.

The 3Di Description of this Trace/Pad Shape

GEOM                             <-- start of a geometry
OBJECT 5                         <-- object property from table
COLOR 9                          <-- color property from table
LAYER 0                          <-- layer property from table
WIRE 0.012500 8                  <-- wire, diameter, number of edges to extrusion polygon
3DPL 5                           <-- defined as a 3D polyline with 5 vertices
1.840900 -3.467400 0.947200      <-- X1,Y1,Z1 (UNITS in HEADER of 3DI file)
1.840900 -3.467400 0.997200
1.860510 -3.666436 1.097200
1.875218 -3.815713 1.097200
1.944500 -4.518900 0.567200