The SINF [Simplified Integrator Nested Format] spec consists of a header section followed by row data. It is a simplified subset of the INF results file from KLA Tencor. The basic structure is shown below:
Header
DEVICE:xxx identification assigned by originator LOT:xxx identification assigned by originator WAFER:xxx identification assigned by originator FNLOC:180 wafer flat position (0=TOP,90=RIGHT,180=BOT 270=LEFT) ROWCT:62 number of rows COLCT:63 number of columns BCEQU:01 List of Bin Codes that are good die (comma or space delimited) REFPX: x-coord of reference die (optional) REFPY: y-coord of reference die (optional) DUTMS:mm die units of measurement (mm or mil) DIECT:3405 the number of die in the map file (optional) XDIES:2.945 step along X YDIES:2.945 step along Y COMMENT: sample a string used to annotate the file (optional)
If the BCEQU: field is missing or blank, the default understanding is that die 01 is considered to be the PASS die.
Row Data
Following the header is row data. It is identified by the keyword RowData: Here are the various hex values one will find in the row data:
00-0A good die (each die type gets its own unique identifier starting
at 00, 01, 02 ...) reserve 0A for the die at wafer center.
0B-F0 bad die
__ no die (underscore-underscore) used as a placeholder in the matrix.
@@ uninspected die
FD-FE edge die (optional)
FF reference die (typically a die that is visually different)
Row data lines (for the HEX variant) look like this:
RowData: __ __ __ __ __ __ __ __ __ __ __ __ 01 01 01 01 __ __ __ __ __ 01 01 01 01 01 RowData: __ __ __ __ __ __ __ __ __ __ 01 01 01 01 01 01 01 01 01 01 01 01 01 01 01 01 RowData: __ __ __ __ __ __ __ __ 01 01 01 01 01 01 01 01 01 01 01 01 01 01 01 01 01 01
Reference Die
There are two ways of locating the reference die:
a) a die marked with bin code FF.
b) REFPX: and REFPY: values in the header.
The coordinate system when REFPX: and REFPY: is used is shown below:
Note: Notice that the X and Y array index starts at 1,1; most other map files consider the starting position to be 0,0. Failing to note this could result in alignment off by 1 die in X and Y.
We're calling this 3 Digit SINF since it looks very similar to SINF but has 3 digit bin ID's and three underscores to hold the empty positions. The header appears to be identical to SINF header.
RowData:___ ___ ___ ___ ___ ___ ___ ___ 000 000 000 000 000 000 RowData:___ ___ ___ 000 000 000 000 000 000 000 000 000 000 000 RowData:___ ___ 000 000 000 000 000 000 000 000 000 000 000 000 RowData:___ ___ 000 000 000 000 000 000 000 000 000 000 000 000 RowData:___ ___ 000 000 000 000 000 000 000 000 000 000
As you can see, instead of 00 they this sample uses 000 to ID each die. While we have no official spec for this variant of SINF, we assume that the range of values are from 000 to 255.
UPDATE MAY 22, 2019
Artwork has received information from a foundry and OSAT who use 3 Digit SINF of the following guidelines. However these guidelines are not necessarily formal standards; as you can see below they are not consistent between users of 3 digit SINF.
Tower Semiconductor (Foundry)
| Bin Code | Description |
|---|---|
| 001-003 | PASS |
| 004-253 | FAIL |
| 253-254 | UGLY |
Amkor Technology (OSAT)
| Single Site | Multi-Site (> 2 die) | ||
|---|---|---|---|
| Bin Code | Description | Bin Code | Description |
| 000 | PASS | 001-200 | PASS |
| 001-100 | FAIL | 001-100 | FAIL |