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Importing AIF Data

An AIF package file might be exported from a package design tool such as APD or UPD and then the results imported into Qckvu3. This would allow companies where the IC designer also has package responsibilities to then merge the resulting GDSII with his chip layout.

Mapping and Filtering

The most important feature is to be able to map the various AIF objects onto layers of the user's choice. This includes:

  • die pad(s)

  • die text

  • die outline

  • die logo

  • wires

  • bond fingers

  • rings

  • ball pads

  • solder mask openings


Since AIF uses the Leonov approach in describing polygons that have islands a boolean must convert to cut lines.

Wire Vias

It may be necessary to generate a special via from the end of a wire down to the bond finger or ring to provide an electrical connnection for the GDSII layout tool.


It may be useful to place strings of text (representing either net names or pin numbers) under the die pads, under the bond fingers and under the ball pads to be used for LVS extraction.

Editing Functions

If you want to get ambitious you could add simple editing functions to move or delete objects. You could also add the ability to place down traces. This might be very useful for drawing out redistribution layers.

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